1 / 4 www.asb.co.kr september 2007 p lerow tm aln0460 internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of lo w noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 450 470 gain db 34 35 gain flatness db ? 0.1 ? 0.2 noise figure db 0.75 0.80 output ip3 dbm 37 38 s11 / s22 db - 18 / - 18 output p1db dbm 21 22 switc hing time (3) ? sec - supply current ma 160 180 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 23 ~ 25 (before fail) package type & size mm surface mount type, 13wx13lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured wi th two tones at an output power of 8 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 3 rf in 8 rf out 10 +vcc other s ground ou t line drawing (unit: mm) feature s s 21 = 35.1 db @ 450 mhz = 34.9 db @ 470 mhz nf of 0.75 db over fr e quency unconditionally stable single 5v supply high oip3 @ low current note: 1. the number and size of ground via holes in a circuit board is criti cal for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. description aln0460 asb inc. (top view) (bottom view) solder stencil area ? 0.4 plated thru holes to ground plane plerow (side view) (recommended footprint) c o u pl er w ebsite: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er c o u pl er 2 - stage single type specifications (in pr o duction) typ. @ t = 25 ? c, v s = 5 v, freq. = 460 mhz, z o.sys = 50 ohm
2 / 4 www.asb.co.kr september 2007 p lerow tm aln0460 internally matched lna module s - param e ters noise figure oip3 p1db 450~470 mhz +5 v typical performan ce (measured) s - parameters & k fa c tor
3 / 4 www.asb.co.kr september 2007 p lerow tm aln0460 internally matched lna module item voltage s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) cu rrent (ma) 4.5 - 17.65 - 28.31 35.10 0.31 0.743 20.85 36.59 126 4.6 - 18.16 - 28.85 35.23 0.32 0.731 21.07 36.99 132 4.7 - 18.61 - 29.39 35.34 0.32 0.741 21.30 37.55 138 4.8 - 19.04 - 29.83 35.42 0.32 0.728 21.48 37.97 144 4.9 - 19.38 - 30.36 35.51 0.31 0.733 2 1.70 38.45 149 5.0 - 19.78 - 30.70 35.60 0.32 0.713 21.77 38.93 155 5.1 - 20.04 - 30.91 35.65 0.32 0.750 21.99 39.37 160 5.2 - 20.34 - 31.24 35.72 0.32 0.734 22.17 39.66 165 5.3 - 20.65 - 31.56 35.79 0.32 0.738 22.41 39.83 171 5.4 - 21.00 - 31.94 35.87 0.32 0.7 58 22.66 40.04 178 5.5 - 21.31 - 32.35 35.93 0.32 0.748 22.82 40.08 185 item temp. s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma) - 40 ? c - 26.12 - 25.77 36.06 0.29 0.585 21.86 38.46 154 - 20 ? c - 25.33 - 25.81 35.89 0.30 0.625 21.76 37.97 155 0 ? c - 24.23 - 25.84 35.77 0.30 0.657 21.83 38.20 156 25 ? c - 22.10 - 25.40 35.63 0.30 0.715 21.68 37.93 155 40 ? c - 21.32 - 25.82 35.50 0.31 0.752 21.69 38.11 155 60 ? c - 20.34 - 26.09 35.39 0.30 0.807 21.61 38.22 154 80 ? c - 19.37 - 26.27 35. 20 0.31 0.871 21.56 38.25 155 100 ? c - 18.66 - 26.67 34.91 0.32 0.936 21.50 38.19 157 rf performance with voltage change rf performance with operating temperature
4 / 4 www.asb.co.kr september 2007 p lerow tm aln0460 internally matched lna module 1) the tantal capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be dete r min ed by customer s dc supply status. 2) so - called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are included insi de the lna module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e quency. application circuit recommended soldering reflow process evalua tion board layout + - aln out in c1 c2 tantal c a pacitor v dc 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 25 x 25mm in out +vcc (for aln series C 13x13mm)
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